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Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
(Institute of Electrical and Electronics Engineers Inc., 2015-05)
This paper proposes a novel approach to evaluate design alternatives for high-speed links on printed circuit boards. The approach combines evaluations of signal integrity and link input power. For a comprehensive analysis, ...
Four-channel WDM transmitter with heterogeneously integrated III-V/Si photonics and low power 32 nm CMOS drivers
(Journal of Lightwave Technology, 2016)
We experimentally demonstrate a novel four-channel
wavelength division multiplexing transmitter operating at 1.3 μm
wavelength employing heterogeneously integrated III-V/Si photonic
circuit copackaged with low-power ...
30-Gb/s Optical Link Combining Heterogeneously Integrated III–V/Si Photonics With 32-nm CMOS Circuits
(Institute of Electrical and Electronics Engineers Inc., 2015-02)
We present a silicon photonics optical link utilizing heterogeneously integrated photonic devices driven by low-power advanced 32-nm CMOS integrated circuits. The photonic components include a quantum-confined Stark effect ...
Flexible transmitter employing Silicon-segmented Mach–zehnder modulator with 32-nm CMOS distributed driver
(Journal of Lightwave Technology, 2016)
We propose a flexible optical transmitter for shortreach optical interconnects that includes a silicon photonic segmented Mach-Zehnder modulator (MZM) driven by a distributed six-channel 32nm SOI CMOS driver integrated ...
A WDM-Compatible 4 × 32-Gb/s CMOS-driven electro-absorption modulator array
(OSA - The Optical Society, 2015)
A four-channel electro-absorption-modulator array, driven by 32-nm CMOS drivers providing 2-V peak-to-peak output swing, operates with BER < 10-12 at a data rate of 4 × 32 Gb/s and dissipates 170 mW of power.