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dc.contributor.authorMuller, Sebastián
dc.contributor.authorReuschel, Torsten
dc.contributor.authorRimolo-Donadio, Renato
dc.contributor.authorKwark, Young
dc.contributor.authorBruns, Heinz-Dietrich
dc.contributor.authorSchuster, Christian
dc.date.accessioned2017-06-05T16:45:06Z
dc.date.available2017-06-05T16:45:06Z
dc.date.issued2015-05
dc.identifierhttps://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7111305es
dc.identifier.issn00189375
dc.identifier.urihttps://hdl.handle.net/2238/7179
dc.descriptionhttps://www.scopus.com/inward/record.url?eid=2-s2.0-84929832756&partnerID=40&md5=1fb9921f20cd25af591cdc63c44ea357es
dc.description.abstractThis paper proposes a novel approach to evaluate design alternatives for high-speed links on printed circuit boards. The approach combines evaluations of signal integrity and link input power. For a comprehensive analysis, different link designs are made comparable through the application of identical constraints, with the link input power as the single figure of merit for a systematic, quantitative comparison of design alternatives. The analysis relies upon a combination of efficient physics-based via and trace models, statistical time-domain simulation, and an analytical input power evaluation, which allows it to handle links consisting of a large number of channels while fully taking into account interchannel crosstalk. The proposed approach is applied to study two fundamental design decisions at the PCB level—single-ended versus differential signaling and signal-to-ground via ratios of 1:1 versus 2:1—for a link consisting of 2048 vias and up to 175 striplines with an aggregate data rate of 1 Tb/s. It is found that both design decisions have a considerable impact on the required input power of the link.es
dc.language.isoenges
dc.publisherInstitute of Electrical and Electronics Engineers Inc.es
dc.rightsAttribution-NonCommercial 3.0 Costa Rica*
dc.rights.urihttps://creativecommons.org/licenses/by-nc/3.0/cr/*
dc.sourceIEEE Transcions on Electromagnetic Compatibility, vol. 57, no. 5, Octuber 2015es
dc.subjectDiseñoes
dc.subjectCircuitoses
dc.subjectPlacas electrónicases
dc.subjectPotencia de entradaes
dc.subjectPotencia eléctricaes
dc.subjectResearch Subject Categories::TECHNOLOGY::Electrical engineering, electronics and photonics::Electronicses
dc.titleEnergy-Aware Signal Integrity Analysis for High-Speed PCB Linkses
dc.typeinfo:eu-repo/semantics/articlees


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Attribution-NonCommercial 3.0 Costa Rica
Excepto si se señala otra cosa, la licencia del ítem se describe como Attribution-NonCommercial 3.0 Costa Rica