Metodología para la Simulación y Fabricación de Circuitos Impresos en Radiofrecuencia

Abstract

This thesis proposes a methodology for design, simulation and fabrication of printed circuits in radiofrequency for the new laboratory of Electronics Department at TEC. The approach to analyze electronic platforms designed in CAD environments and CAE environments is detailed. Prototype multilayer printed circuits are discussed and for this reason, an analysis of the plate profile is performed to define the variation range of the stackup for a nominal impedance of 50Ω. The proposed methodology is validated through the case of impedance control for striplines, microstriplines and lines with vias operating at frequency up to 5 GHz. Optimizations are made of all the elements present in the printed circuit (lines, pads, antipads, insulations, tracks, through hole and surface mount connectors), to ensure that the entire process is controlled. The manufactured results are correlated against the simulated ones and are analyzed in terms of electrical performance.